Rationale 1: The common part made only sense for (some) NXP ARM7 MCUs,
but was misleading for MCUs like the LPC1768.
Rationale 2: The common part was only used by one specific MCU
implementation - no need to outsource it.
Many modules have subdirectories. Often these subdirectories should only
be included under certain circumstances. Modules that use submodules
currently need to use this pattern:
```make
DIRS = …
all: $(BINDIR)$(MODULE).a
@for i in $(DIRS) ; do $(MAKE) -C $$i ; done ;
include $(RIOTBASE)/Makefile.base
clean::
@for i in $(DIRS) ; do $(MAKE) -C $$i clean ; done ;
```
This PR moves the `all:` and `clean::` boilerplate into `Makefile.base`.
Closes#993.
We do not need to descend into the modules to know what to do on
`make clean BOARD=blub`. We can just invoke `rm -rf bin/blub`.
This PR only keeps the descending into the USEPKGs, since they might
want to delete cached/downloaded/extracted data.
